Mock up - for discussion

mmWave excellence by design

The Future of Satellite Communications

Curl-E develops millimetre-wave RF technology that enables smaller, lighter and higher-performance satellite communications.

10x
size reduction
Patented
resonator architecture
Scalable
lithography fabrication

About Curl-E

Our Mission

At Curl-E, our mission is to move the satellite communications industry forward to a more efficient, cheaper and scalable future.

Our Technology

Curl-E has developed a patented resonator architecture that enables compact, high performance RF components for next-generation satellite communications.

Our Team

Our team is made up of experienced RF scientists and researchers, with decades of experience in the industry and academia.

A New Approach

Satellite communications are moving to higher frequencies, but current RF hardware forces trade-offs between size, performance and cost.

At Curl-E, we have created a fundamentally new approach designed to combat these trade-offs.

Existing solutions

Bulky, lossy or expensive

The Curl-E approach

A compact, scalable and cheaper future

Technology

3D render of a concentric split-ring resonator on a substrate

Resonators

Our new resonator design allows for a 10x size reduction, high performance at sub 20 GHz and scalable lithography fabrication while being less sensitive to minor manufacturing mistakes and imperfections.

3D render of a filtenna: stacked resonators beneath a square patch antenna

Filtennas

Our filtenna technology combines filtering and antenna functionality into a single compact device, reducing size, insertion losses and overall system complexity while maintaining high RF performance.

3D render of a filtenna array: a regular grid of devices on one substrate

Filtenna Arrays

Our technology is not just a single device, but rather a platform technology that can be applied to various other devices. These include: antenna arrays, couplers and more.

Manufacturing Process

  1. Gloved hand holding a patterned wafer under yellow cleanroom light

    Step 1

    Development

    Photoresist is applied to the wafer and spun until uniform. Desired features to be developed utilising greyscale masks.

  2. Silver metalised wafer patterned with rows of devices

    Step 2

    Metalisation

    The wafer is entirely metalised with an exceptionally thin yet uniform layer of silver.

  3. Individual devices laid out in a white nine-compartment tray

    Step 3

    Assembly

    The wafer is diced into individual devices, which are then assembled into the finished component.

Finished Product

Patented Tech

Patents

  • Split distributed resonator architecture
  • PCB-fed split concentric ring resonator and filter

IP assets

  • Design libraries
  • Fabrication knowledge and experience
  • Lithographic manufacturing process

Internal Knowledge

  • Process expertise
  • Integration knowledge and experience

Roadmap

  1. 2026

    • Process refinement
    • Product qualification
    • Pilot customers
  2. 2027

    • Continued product refinement
    • Initial product launch with pilot customers
  3. 2028

    • Manufacturing scale-up
    • External validation
    • Multi-customer revenue expansion

Contact Us

Inquiries? Let us know below.

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